Overview
Join Microsoft Research Cambridge to invent optical interconnects that deliver power efficient and reliable with optical IO links.
Department/Organization/Location: Microsoft Research Cambridge (Cambridge, UK), working with researchers and partner engineering teams on next-generation optical I/O for AI infrastructure.
Current mainstream interconnect technologies face a fundamental trade-off: copper links are power-efficient and reliable but limited in reach, while optical links extend reach but often increase power and reduce reliability. Our program explores a new approach based on a “wide-and-slow” architecture (many parallel, lower-rate channels) to break this trade-off and enable scalable, manufacturable optical I/O.
This is a unique opportunity for an exceptional researcher to work in a leading industrial research environment, collaborating closely with world-class researchers at Microsoft and engineering partners across the ecosystem.
Responsibilities
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Design and execute DOE plans to evaluate and optimize high-speed optoelectronic transmitter and receiver architectures.
- Design, simulate, and optimize optoelectronic devices, for example photodiodes, microLEDs.
- Develop equivalent circuit and compact models for electro-optic devices to enable co-simulation with electronic circuits (e.g. drivers, TIAs).
- Perform comprehensive electrical, optical, and electro-optical characterization under DC and high-frequency conditions.
- Develop automated test, masurement and data analysis workflows and correlate experimental results with simulations to identify performance-limiting mechanisms.
- Collaborate with internal teams and external partners to support device fabrication, tape-outs and post-silicon validation.
- Communicate findings through technical resorts, presentations and well-documented experimental records.
Required/Minimum Qualifications:
- PhD (or near completion) in Electrical Engineering, Physics, Photonics, Optical Engineering, or a related field, with strong knowledge of semiconductor device physics and light-matter interactions.
- Experience in the design, simulation and optimization of high-speed optoelectronic devices such as VCSELs, microLEDs, modulators and/or photodetectors.
- Proficiency with optical and electrical simulation tools (e.g. Lumerical, COMSOL, tidy3D, HFSS, TCAD, or similar).
- Hands-on experience with electrical, optical and electro-optical characterization of devices in a laboratory environment.
- Strong programming, analytical and communication skills, with experience using Python, Matlab or equivalent for data analysis and automation.
Preferred/Additional Qualifications:
- Familiarity with high-speed optical communication systems and optoelectronic device fabrication in a III-V and/or silicon photonics platform.
- Experience with photonic foundry tape-outs, PDK development and design-for-manufacturability.
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Knowledge of optical packaging, co-packaged optics, or optical transceiver architectures.
The base pay for this internship is £ 3,700.00 per month. Certain roles may be eligible for benefits and other compensation.
Find additional benefits and pay information here:
https://careers.microsoft.com/v2/global/en/corporate-pay/interns-corporate-pay.html
This position will be open for a minimum of 5 days, with applications accepted on an ongoing basis until the position is filled.
Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. If you need assistance with religious accommodations and/or a reasonable accommodation due to a disability during the application process.
