The technology and capabilities RAM Innovations is developing are key enablers in the transition to Net-Zero. Building on existing projects we have an exciting roadmap for the future and you could be part of that.
We’re looking for bright, driven individuals to help us to unleash the power of embedded die packaging and take GaN and SiC based solutions to next level.
You’ll be part of a team of experts in a friendly and open environment, where all our people are encouraged by a working culture that offers empowerment, collaboration, and innovation.
Standard benefits include:
3 x annual salary life assurance.
Minimum 23 days annual leave, rising to 28 days for long-term employees.