Process Engineer
The Role
You will be responsible for developing, optimising and controlling advanced electronic and semiconductor assembly processes, with particular focus on die attach and interconnect technologies for high‑performance devices.
Working closely with design, RF, quality and operations teams, you will support new product introduction while driving process robustness, yield improvement and manufacturability.
Key Responsibilities
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Develop and optimise die attach processes, including silver epoxy, silver sintering and eutectic attach.
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Define and control process windows for temperature, pressure, time and atmosphere.
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Develop and optimise gold wire and ribbon bonding processes across multiple substrates and metallisations.
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Perform process validation, reliability testing, pull and shear testing.
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Support DFM and DFA reviews and new product introduction activity.
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Define process flows, SOPs and control plans.
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Implement SPC, yield monitoring and Cp/Cpk analysis.
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Lead root cause analysis and continuous improvement activities.
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Support evaluation of new materials, equipment and manufacturing technologies.
Essential Requirements
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Degree in Engineering, Materials Science, Physics or equivalent experience.
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Experience within electronics manufacturing, semiconductors
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Hands‑on experience with die attach and or wire bonding processes.
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Strong understanding of materials behaviour, thermal management and reliability.
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Proven problem‑solving ability within a manufacturing environment.
Desirable
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Background in high‑precision automotive electronics or power electronics.
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Experience supporting automation or scaling manufacturing processes.
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Knowledge of RF packaging requirements and industry standards.
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Familiarity with ISO 9001 or similar quality systems.
