AI is growing faster than any technology in history and the explosion in demand has created a massive infrastructure gap; we can no longer build chips or power stations fast enough to keep up. The industry is still leaning on a ten-year-old hardware blueprint that has reached its limit. A new paradigm that is faster and more efficient will be the biggest economic opportunity of the next century and create the most important company of the next decade. The OLIX Decode Accelerator 1 (DX-1) is the first accelerator architected specifically for decode. Rack-scale co-design of logic, data movement, packaging, optics and interconnect enables a step change in system level performance.
At OLIX, the performance of our technology depends not only on silicon design, but on how effectively that silicon is packaged, integrated, and scaled into products. As we move from early architecture and prototype development toward productisation, the Senior / Staff Packaging Engineer will play a critical role in defining and delivering the packaging solutions that enable our ASICs to become high-performance systems.
This is a hands-on, high-impact engineering role focused on front-end package design, ASIC-to-substrate integration, and advanced 2.5D and 3D packaging. You will work across silicon, substrate, package, and board-level interfaces to ensure package solutions meet performance, manufacturability, and integration requirements from concept through to production readiness.
You will lead packaging engineering across the full development flow, including package architecture, detailed design, layout, simulation, and product readiness. This includes defining package design methodologies, owning substrate design, delivering PI/SI simulations, and supporting substrate and PCB integration as needed. Working closely with the ASIC team, you will translate die requirements into package solutions that are electrically robust, manufacturable, and ready for system integration.
A key part of the role will be owning the end-to-end package design flow for next-generation AI hardware, including package architecture, bump and substrate design, package layout, high-speed and power delivery integration, PI/SI-driven optimisation, and substrate/PCB co-design.
Advanced Package Architecture & Design
Own package design activities for ASIC-to-substrate integration, including bump/pad mapping, substrate escape, interconnect strategy, package floorplanning, and stack-up definition
Lead the development of 2.5D and 3D package architectures, including multi-die integration, chiplet-style interfaces, and heterogeneous integration approaches
Define package structures that meet electrical, thermal, mechanical, reliability, and manufacturability requirements
Translate silicon and system requirements into practical package design rules, routing constraints, and implementation strategies
Drive package technology selection based on performance, risk, manufacturability, cost, and scalability
Full Package Design Flow
Own or lead the full package design flow, from concept definition through detailed design, analysis, layout, verification, release, and manufacturing support
Develop and review package layouts including die placement, substrate routing, power/ground distribution, high-speed interface breakout, and physical integration constraints
Own and execute PI/SI simulation activities to validate signal integrity, power delivery, and package performance, translating results directly into design improvements and sign-off decisions
Support package-to-board co-design, including substrate layout and PCB layout/interface definition where required
Ensure strong alignment between die, package, substrate, and board-level implementation
Oversee package database management, design reviews, sign-off, and release readiness
Tools, Methods & Implementation
Use package design tools such as Cadence Allegro X APD, or equivalent to develop and maintain advanced package and substrate layouts
Establish and improve package design libraries, templates, rules, and workflows to support efficient and repeatable development
Drive layout reviews, implementation checks, and sign-off processes to ensure package integrity and compliance with technology and manufacturing constraints
Support tool flow development and integration across package, substrate, simulation, and PCB environments
Ensure robust design data handoff to substrate vendors, OSATs, and manufacturing partners
Cross-Functional Engineering
Work closely with ASIC, mechanical, thermal, and systems engineers to optimise package performance and system integration
Collaborate with substrate vendors, OSATs, foundries, and external partners on stack-ups, design rules, implementation feasibility, and manufacturing readiness
Lead packaging input into architecture reviews, risk assessments, and development planning
Ensure package design decisions support broader product requirements including manufacturability, reliability, serviceability, and scale
Act as the key interface between package design and adjacent engineering domains
Manufacturing & Productisation Support
Ensure package designs are aligned with assembly, qualification, reliability, and manufacturing requirements
Lead DFM/DFX activities for advanced package technologies and substrate implementations
Support prototype build, bring-up, qualification, and early production with strong technical ownership of packaging-related issues
Participate in root cause analysis and corrective action for packaging or integration issues identified during build, test, or reliability assessment
Review substrate deliverables, fabrication outputs, and manufacturing documentation for completeness and technical quality
8+ years' experience in advanced semiconductor packaging for ASIC or other high-performance products
Deep expertise in front-end package design, including ASIC-to-substrate integration
Strong experience with 2.5D and/or 3D package architectures
Strong hands-on capability with package design tools such as Cadence Allegro, Siemens Xpedition, or equivalent
Experience leading package development across layout, simulation, verification, and release
Strong hands-on PI/SI simulation capability, including experience running package-level signal integrity and power delivery analysis using tools such as Ansys SIwave, Cadence Sigrity, or equivalent
Experience in substrate design and package-to-board integration
Good understanding of manufacturability, interconnect technologies, and package reliability
Proven ability to work across multidisciplinary engineering and external partner teams
Strong technical judgement, communication, and problem-solving skills
Degree in a relevant engineering or physical sciences discipline
Experience with AI accelerators, high-performance compute, networking, or advanced data-centre hardware
Familiarity with wafer-level packaging
Experience mentoring engineers
Familiarity with package reliability, qualification, and failure analysis workflows
Exposure to new product introduction and scaling advanced package technologies into production
Competitive Salary: Commensurate with your experience, skills, and location
Equity & Ownership: Meaningful stock options. You’re not just joining the mission; you’re owning a piece of it
Proximity Bonus: We value your time. To minimise your commute and maximise your life, we offer an annual Living-Local Bonus if your residence is within 20 minutes of the office
Retirement Benefits: Employer-contributed retirement plans to help you build long-term financial security.
Due to U.S. export control regulations, candidates’ eligibility to work at OLIX depends on their most recent citizenship or permanent residency status. We are generally unable to consider applicants whose most recent citizenship or permanent residence is in certain restricted countries (currently including Iran, North Korea, Syria, Cuba, Russia, Belarus, China, Hong Kong, Macau, and Venezuela). Applicants who have subsequently obtained citizenship or permanent residency in another country not subject to these restrictions may still be eligible.
