RAM Innovations is a small but fast-growing business at the forefront of developing advanced packaging techniques for the semiconductor industry. Situated on Deeside in North Wales, a ten-minute drive West from the historic city of Chester, the business is in the process of transitioning from a niche R&D business to a manufacturing-oriented business underpinned by a strong R&D base.
RAM has developed a world leading process to embed bare semiconductor dies directly into printed circuit boards, enabling both significant improvements in efficiency and a reduction in the size and weight of power electronics modules. As the world continues its transition towards Net-Zero, smaller and more efficient power electronics are an essential building block to the electrification of all types of transport and many industrial processes.
RAM is already collaborating with a number of aerospace and automotive OEMs and Tier 1 suppliers to develop and manufacture hardware on a commercial basis. We are also continuing to invest in R&D through grant funded collaborations with partners including the Compound Semiconductor Applications Catapult.
We are actively recruiting to expand the team and are looking for people with a strong technical mindset, who are willing to work with teammates, customers and partners to find solutions and drive the business forward. We have a number of positions opening up in the near future and are interested in hearing from potential colleagues with a broad spectrum of technical experience, ranging from seasoned senior technology leaders, to aspiring junior engineers.
Qualifications
We are looking for people who have achieved a minimum of HNC or degree level qualifications through education or time served experience. Educational experience within some of the following fields is of particular interest:
Mechanical engineering
Product development
Electrochemistry
Process engineering
Chemical engineering
Electronics
Manufacturing
Experience
In terms of work experience, we are looking for people who are interested in building on their existing skills to develop deep domain knowledge across a number of elements of RAM’s process capabilities. Previous experience of some of the following areas is required:
3D CAD modelling
PCB manufacturing
New product introduction processes
Design for manufacturing
Use of Gerber files and PCB layout software (Altium)
Electronics manufacturing
Material selection
Manufacturing processes involving chemical and electrochemical processes
IPC standards relevant to PCB/PCBA design and manufacturing
Report writing
Low to mid-volume electromechanical design, assembly and test
Interaction with customers and partners through R&D projects
Join us!
We need team members to be ‘hands on’ and most roles will be a mix of office and lab/shopfloor activities
We are delivery focused and will only achieve our potential if we follow through on our commitments to our customers and partners
We are a flexible working employer and are currently experimenting with a 4-day week for manufacturing activities
As a business that will grow rapidly over the next few years, there will be plenty of opportunities for career development and we will support with funding third party training as required
Most of all, we are offering team members the opportunity to help build a dynamic UK engineering and manufacturing business that can help accelerate the transition to Net-Zero
Please send CV and covering letter to: [email protected]
