Package design engineer Work, Jobs in Shefford, Bdf (with Salaries)

IC Package Design Engineer
Qualcomm —Cambridge
- Doctoral degree
- CAD
- Engineering
- Employee stock purchase plan
Project Engineer
Levidian Nanosystems Ltd —Cambridge
- £45,000 - £60,000 a year
- Full-time
- PMP
- Writing skills
- Engineering
- Health & wellbeing programme
- Flexitime
Quick apply
5d
QA Engineer
Fleet Assist —Huntingdon
- £30,000 - £40,000 a year
- Full-time
- Hybrid work
- Azure
- SQL
- AI
- Free parking
- Annual leave
Quick apply
5d
Manufacturing Engineer
Precise Component Manufacture Ltd —Potton
- £37,000 - £42,000 a year
- Full-time
- Microsoft Word
- Computer literacy
- Continuous improvement
- Free parking
- Health & wellbeing programme
Quick apply
7d
Apprentice Building Services Design Engineer
Baileygomm Ltd —Ware
- From £8 an hour
- Full-time
- Computer literacy
- Master's degree
- Maths
Quick apply
Senior Graphic Designer - RuneFest
Jagex —Cambridge
- Organisational skills
- Annual leave
- Flexible schedule
Junior Software Engineer - AUM
Ipsos —Cambridge
- Research
- Software development
- Annual leave
Design Engineer - Aviation / Building Services
Gallifordtry —Stansted
- Full-time
- HVAC
- Communication skills
- Employee assistance programme
- Employee discount
Electrical Design Engineer
Equans —Cambridge
- Full-time
- Bachelor's degree
- Communication skills
- Annual leave
- Employee assistance programme
GRADUATE STRUCTURAL ENGINEER
Cistec Chartered Structural & Civil Engineers —Milton Keynes
- English
- Maths
CAD Technician (MEP)
David Bedwell Limited —Cambridge
- £22,000 - £35,000 a year
- Full-time
- AutoCAD
- Quality control
- In-person
- Flexitime
Quick apply
Junior Mechanical Engineer
Red Bull Technology Group —Milton Keynes
- Full-time
- Engineering
- Continuous improvement
- Manufacturing
11d
Junior Hardware Engineer
Moog Inc. —Luton
- Full-time
- Laboratory experience
- In-person
- Annual leave
1d
Full-Stack Engineer
Altium —Cambridge
- Full-time
- Remote
- Analysis skills
- Organisational skills
- In-person
- Free parking
- Referral programme
Quick apply
Senior Mechanical Design Engineer
Engineer-O-Matic —Holywell
- £58,000 - £60,000 a year
- Full-time
- CAD
- Engineering
- Analysis skills
- Free parking
- Annual leave
Quick apply
Electromagnetics Design Engineer
Parker Hannifin Corporation —Stevenage
- Full-time
- Communication skills
- Employee assistance programme
- Employee discount
Graduate Silicon Engineer
Graphcore Early Careers —Cambridge
- Computer Science
- Engineering
Senior IT Infrastructure Manager
Cable Security Network UK Ltd. —Cambridge
- £75,000 - £100,000 a year
- Full-time
- Azure
- Computer Science
- Master's degree
- Free parking
- Health & wellbeing programme
Quick apply
Project Design Engineer (Gas) - REF: 2618
Fingleton White —Hemel Hempstead
- Full-time
- Hybrid work
- Engineering
- English
- Bachelor's degree
- Health & wellbeing programme
- Employee assistance programme
Quick apply
Bioinformatics Scientist/Engineer – DRAGEN Array
Illumina —Cambridge
- Full-time
- Doctoral degree
- Computer Science
- Mentoring
4d

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package design engineer jobs near shefford, bdf

IC Package Design Engineer

Qualcomm -
Cambridge

Apply Now

Job details

Benefits

Employee stock purchase plan
Company pension
Discounted gym membership

Qualifications

Doctoral degree
Mechanical design
CAD
Engineering
Electronics Engineering
Electrical engineering
PCB
Master's degree
Bachelor's degree
Packaging

Full job description

Company:

Qualcomm Technologies International Ltd

Job Area:

Engineering Group, Engineering Group > ASICS Engineering

General Summary:

About the Role

The Central Hardware Systems Team at Qualcomm has an opening for an IC Package Design Engineer. The team

is responsible for road mapping, architecting, design methodology, design implementation, and verification for

all Qualcomm package products.

Principal Duties and Responsibilities will include:

Responsible for Package/SIP physical design and layout, optimization, DV, and tape out.

Work with multi-functional teams to achieve optimized mechanical, electrical RF & SI/PI, and thermal

performance for various classes of chips.

Work with IC Physical Design team on top level floor planning including hard macro block placement,

Redistribution Layer, and bump/ball pattern/assignment

Drive methodology, innovations, and efficiency improvements in package design together with vendors

and developers on feature development and bug resolution.

Explore, evaluate, and develop new CAD tools, design, and verification flows.

Work with marketing/IC/product teams on competitive analysis and road mapping package technology

for future products

Minimum Qualifications:

Bachelor's degree in Science, Engineering, or related field.

Minimum Qualifications:

Bachelor's degree in Science, Engineering, Material Science or related field

Preferred Qualifications:

Master's degree or PhD in Electronic Engineering, Material Science, or related field.

Basic knowledge in high-speed IO interfaces and electromagnetic field.

Knowledge of IC packaging structures and package-board interaction.

Basic knowledge of electronic packaging process and typical failure modes preferred.

Proven fundamentals in electrical, material, thermal, or mechanical engineering fields.

Familiarity with various sophisticated package configurations and assembly/substrate technology (Flip chip BGA, 2.5D/3D Interposer, etc.).

Experience in package design and proficiency in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP).

Basic understanding of some SI/PI tools (XtractIM, PowerSI, HFSS, Q3D, etc.), package model extraction, S-parameters, and RLGC model.

Basic knowledge of substrate manufacturing process, structure, design rules, and material properties.

Proven understanding of RF and high-speed interfaces, including DDR, PCIe, UCIE, etc.

Experience with Calibre tool and package design reviews.

Knowledge of high-speed layout constraints (crosstalk mitigation, differential pairs).

Solid understanding of Design Rules Check and Design for Manufacturing.

Experience with 2.5D Si-Bridge design in Virtuoso or similar CAD tools is a plus.

What's on Offer

Apart from working in an open, relaxed and collaborative space, you will enjoy:

Salary, stock and performance related bonus

Maternity/Paternity Leave

Employee stock purchase scheme

Matching pension scheme

Education Assistance

Relocation and immigration support

Life, Medical, Income and Travel Insurance

Subsidised gym membership

Bicycle purchase scheme

*References to a particular number of years experience are for indicative purposes only. Applications from candidates with equivalent experience will be considered, provided that the candidate can demonstrate an ability to fulfill the principal duties of the role and possesses the required competencies.

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail [email protected] or call Qualcomm's toll-free number found here . Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

To all Staffing and Recruiting Agencies : Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.

If you would like more information about this role, please contact Qualcomm Careers .

Apply Now

Refine Your Search

package design engineer jobs in shefford, bdf

IC Package Design Engineer

Project Engineer

QA Engineer

Manufacturing Engineer

Apprentice Building Services Design Engineer

Senior Graphic Designer - RuneFest

Junior Software Engineer - AUM

Design Engineer - Aviation / Building Services

Electrical Design Engineer

GRADUATE STRUCTURAL ENGINEER

CAD Technician (MEP)

Junior Mechanical Engineer

Junior Hardware Engineer

Full-Stack Engineer

Senior Mechanical Design Engineer

Electromagnetics Design Engineer

Graduate Silicon Engineer

Senior IT Infrastructure Manager

Project Design Engineer (Gas) - REF: 2618

Bioinformatics Scientist/Engineer – DRAGEN Array

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